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教师

       李晓春，教授，博士生导师

       上海交通大学电子信息与电气工程学院、射频异质异构集成全国重点实验室、教育部高速电子系统设计与电磁兼容研究重点实验室教授，博士生导师，国家自然科学基金优秀青年科学基金获得者,上海交通大学晨星学者。

       长期从事高速与微波电路、互连技术、电磁兼容等研究工作，发表论文100余篇，其中被SCI收录论文60余篇，被EI收录论文100余篇。主持国家自然科学基金优秀青年科学基金、国家重点研发课题等多个项目，参与国家自然科学基金创新研究群体科学基金、973项目、863项目、三星项目、华为项目等。

       博士学位论文“高速集成电路中互连线信号响应与功耗的分析优化”获2011年全国优秀博士学位论文提名奖、以及上海市研究生优秀成果奖。科研项目“电源完整性研究”获2014年“国际大川情报通信基金研究奖”；科研项目“小型化高性能微波无源元件与天线”获2008年国家技术发明二等奖；科研项目“新型微波射频电路研究”获2005年上海市科技进步一等奖。2010年获得上海交通大学SMC-晨星青年学者称号。2011年获得电子信息与电气工程学院“优秀共产党员”称号。 2014年在常熟高新区挂职，获苏州市科技镇长团优秀团员称号。2016获上海交通大学烛光奖励计划二等奖，上海交通大学优秀党务工作者称号。2019年获上海交通大学“教书育人奖”三等奖。培养研究生、本科生获得上海市优秀毕业生、上海交通大学学生年度人物等称号。
       担任中国电子学会青年科学家俱乐部成员、中国电子学会青年女科学家会员、微波与电路系统专委会成员，2020年ICMMT国际会议TPC主席，IEEE EDAPS国际电子器件封装会议TPC成员，International Conference on ASIC proceedings分会主席,《上海交通大学学报》英文版客座编辑。常年担任IEEE Trans. Electron Devices、IEEE Trans. Microwave Theory and Techniques、IEEE Trans. CPMT, IEEE Trans. EMC，IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems、Journal OF Circuits, Systems and Computers，International Journal of Electronics，VLSI DESIGN，Science in China Series F-Information Sciences，以及《电子学报》、《微波学报》、《上海交通大学学报》、《VLSI 设计与测试及电子设计自动化》《计算机辅助设计与图形学报》等刊物审稿人。

教育经历

  • 1995年－1999年  天津大学   电子工程系   本科
  • 1999年－2002年  天津大学   电子工程系   硕士
  • 2003年－2007年  上海交通大学 电子工程系 博士

工作经历

  • 2002年－至今    上海交通大学电子信息与电气工程学院 现为教授
  • 2008年-2009年   美国乔治亚理工学院 电气与计算机工程学院 访问学者
  • 2013年-2014年 常熟高新技术产业开发区科技与知识产权局挂职  副局长

获奖情况

  • 2008年“小型化高性能微波无源元件与天线”获国家技术发明二等奖，第五获奖人。
  • 2005年“新型微波射频电路研究”获上海市科学技术进步一等奖，第五获奖人。
  • 2011年获全国优秀博士学位论文提名，并获上海市研究生优秀成果（学位论文）。
  • 2014年获国际大川情报通信基金研究奖。
  • 2015-2016学年上海交通大学烛光奖励计划二等奖。
  • 2011年获全国微波毫米波会议优秀论文奖。
  • 2015年获全国天线年会优秀论文奖。
  • 2011年获“电子信息与电气工程学院优秀共产党员称号”。
  • 2014年获苏州市科技镇长团优秀团员。
  • 2016年获上海交通大学优秀党务工作者。
  • 2019年上海交通大学“教书育人奖”三等奖
  • 2020年指导硕士生彭志鹤获“上海市优秀毕业生”
  • 2020年指导储英计划学生孙琦获“上海市优秀毕业生”
  • 2022年论文“A Horizontal Gradual Ultra-Low-Reflection Stripline to Grounded Coplanar Waveguide Transition”, 获最佳论文提名，IEEE MTT-S IWS best student paper honorable mention.
  • 2022年论文“A Compact Rejection Filter Based on 2.5-D Spoof Surface Plasmon Polaritons and Folded Spilt-Ring Resonators，”获最佳学生论文奖，第34届亚太微波会议（Asia-Pacific Microwave Conference, APMC 2022）.
  • 2024年中国电子学会科学技术奖 毛军发射频集成电路创新团队奖（5/15）

科研项目

  1. 国家自然科学基金面上项目，“太赫兹介质波导互连技术研究”项目批准号：62371284，起止时间：2024.01-2027.12，经费：49.00万元。
  2. 国家自然科学基金优秀青年科学基金，高速电互连技术，项目批准号：61522113，起止时间：2016.01-2018.12。
  3. 国家自然科学基金面上项目，新型高温超导互连技术研究”项目批准号：61771311，起止时间：2018.01-2021.12。
  4. 国家自然科学基金青年科学基金项目，SOC集成电路中互连线的电热协同分析，项目批准号：60806012，起止时间：2009.01.01—2011.12.31。
  5. 国家重点研发计划“2.5D 高性能光电耦合封装集成技术研究”，课题负责人，课题编号：2019YFB1802904，起止时间：2020.01-2023.12，经费：349万元。
  6. 国家重点研发计划“基于AI 的集成电路物理设计EDA 技术研究”子课题负责人，课题编号：2019YFB2205001，起止时间：2020.01-2023.12，经费：87.4万元。
  7. 上海市科委，高速电互连技术，2016.01-2018.12。
  8. Samsung Electronics Co., Ltd., Analysis of WiFidesensing through the EMI modeling of a PCB module with multiple IC/PKG's，起止时间：2015.01-2015.12。
  9. Samsung Electronics Co., Ltd., Research on high-speed interconnection method on boards, 2015.01-2015.12.
  10. Samsung Electronics Co., Ltd., Research on Signal and Power Integrity Co-analysis and Design in Multilayer Package, 2014.04-2015.03.
  11. Okawa Foundation Research Grant Program, Research on modeling and design of Power distribution network (PDN), 2014.04-2015.03.
  12. Samsung Electronics Co., Ltd., Research on power integrity (PI) characteristic in the multi layer PCB that tests low power & high speed device and its solutions, 2013.04-2014.03. 
  13. 上海紫竹新兴产业技术研究院，脉冲控制信号的整形技术研究，2014.07-2015.07。

代表性论文

教学论文

  1. 李晓春，张晗，“L节匹配网络的应用条件，”电气电子教学学报，43（4）：125-127，2021年8月。

期刊论文

2025年

  1. Rui Zhang, Lixiao Wang, Ze-Ming Wu, Yu-Xu Liu, Hongmei Zhao, Xiao-Chun Li*, and Qing Huo Liu*, “Observation of Terahertz Planar Chirality Enabled by C‐Points in Accidental Bound States in the Continuum,” Laser and photonics reviews, 2025, e01023, 1-9. DOI: 10.1002/lpor.202501023
  2. H. -B. Zhan, X. -C. Li*, C. -S. Sun and K. Ning, "A Bent Connector Between Two Rectangular Dielectric Waveguides at W-Band," in IEEE Microwave and Wireless Technology Letters, vol. 35, no. 7, pp. 1021-1024, July 2025.
  3. Z. -M. Wu, Z. Li, H. -B. Chen, X. -C. Li, H. -B. Zhan and K. Ning, "Design of Wideband Microstrip-to-Microstrip Vertical Transition With Pixel Structures Based on Reinforcement Learning," in IEEE Microwave and Wireless Technology Letters, vol. 35, no. 3, pp. 274-277, March 2025
  4. Ken Ning, Yan-Rong Zhu, Xiyao Liu, Yu-Xu Liu, Zong-Rui Xu, Xiao-Chun Li, and Junfa Mao, "Mode Composite Ridged Substrate Integrated Coaxial Line for Multichannel Operation," in IEEE Transactions on Microwave Theory and Techniques, vol. 73, no. 8, pp. 5203-5214, Aug. 2025.
  5. Z. Li, Z. -M. Wu, X. -C. Li*, S. -P. Gao, Y. -X. Guo and J. -F. Mao, "A POD-Enhanced Multi-PCE DNN for High-Dimensional Uncertainty Quantification of High-Speed Circuits," in IEEE Transactions on Microwave Theory and Techniques, vol. 73, no. 8, pp. 4468-4479, Aug. 2025.
  6. M. Jiang, Q. Sun, Q. Huo Liu and X. -C. Li, "Deep Image Prior-Based Super Resolution for Fast Electromagnetic Forward Modeling," in IEEE Transactions on Antennas and Propagation, vol. 73, no. 3, pp. 1900-1905, March 2025. 
  7. H. Chen, S. Li, Z. Wu, L. Wang, X. -C. Li and Q. H. Liu, "Multihead Discrete Action Calibration Proximal Policy Optimization Method for Pixel Antennas With High Degrees of Freedom," in IEEE Transactions on Antennas and Propagation, vol. 73, no. 5, pp. 2881-2894, May 2025. 

2024年

  1. Xin He, Yu-Xu Liu, Xiao-Chun Li*, “A Wideband Dual-Component Electric Probe for Near-Field Measurement,” IEEE Sensors Journal, vol.24, no. 14, pp. 22781-22789, Jul. 2024. 
  2. Yu-Xu Liu, Xiao-Chun Li*, “A Dual Component Electromagnetic Probe for Efficient Near-Field Measurement,” IEEE Antennas and Wireless Propagation Letters, vol. 23, no. 11, pp. 4002-4006, Nov. 2024.
  3. Zhe Gao, Yu-xu Liu, Xiao-Chun Li*, Ze-Ming Wu, Zheng Li, Tao Tan, “An Equivalent Radiation Source Reconstruction Method Based on Enhanced Artificial Neural Network,” IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 4, pp. 1203-1212, Aug. 2024. 
  4. Chang Sheng Sun, Xiao-Chun Li*, Hai-Bing Zhan, “A Low-Loss and High-Bandwidth Hollow Rectangular Dielectric Waveguide for Sub-THz Applications,” IEEE Transactions on Microwave Theory and Techniques, vol. 72, no. 10, pp. 5961-5969, Oct. 2024. 
  5. Hanbing Zhan，Xiao-Chun Li*，Chang Sheng Sun，Ken Ning, “Low-Loss Perpendicular Transition Between Rectangular Dielectric Waveguide and Microstrip Line at W-band,” IEEE Transactions on Microwave Theory and Techniques，2024 early access.
  6. Haibing Zhan, Xiao-Chun Li*, “Low-Loss Horizontal Transition between Rectangular Dielectric Waveguide and Microstrip Line at W-Band,” IEEE Microwave and Wireless Technology Letters, vol. 34, no. 4, pp. 371-374, April 2024. 
  7. Yu Zhu, Xiao-Chun Li*, “A Large Frequency Ratio Dual-Band Integrated Bandpass Filter Based on MCSICL Structure,” Electronics, 13, 754, pp.1-12, 2024. 
  8. Yu Zhu, Xiaochun Li, and Junfa Mao, “An Ultra-Wideband Substrate Integrated Coaxial Line Array Based on Silicon-Based MEMS Process,” Journal of Circuits, Systems and Computers, vol. 33, no. 18, 2550016-1:20, Oct. 2024. 
  9. Rui Zhang, Xiao-Chun Li*, Qing Huo Liu*, “Switchable and multifunctional terahertz photonic devices based on VO2-assisted phase encoded metasurfaces,” Optics and Laser Technology, 174 (2024) 110568. 
  10. Rui Zhang, Xiao-Chun Li*, and Qing Huo Liu*, “Tunable terahertz intrinsic chiroptical absorption empowered by accidental bound states in the continuum,” Appl. Phys. Lett., vol.125, issue. 21, pp.211701.1-12, Nov. 2024.

2023年

  1. Yu-Xu Liu, Xiao-Chun Li*, Xin He, Zhi-He Peng, Jun-Fa Mao, “An Ultra-Wideband Electric Field Probe With High Sensitivity for Near-Field Measurement,” IEEE Transactions on Instrumentation and Measurement, vol. 72, pp.8001910:1-10, Mar. 2023.
  2. Xin He, Xiao-Chun Li*, Yuxu Liu, Junfa Mao, “A High-Performance Miniaturized Wideband Active Electric Probe Design,” IEEE Antennas and Wireless Propagation Letters, vol. 22, no. 12, pp. 2866-2870, Dec. 2023. 
  3. Xin He, Xiao-Chun Li*, Yuxu Liu, Jun-Fa Mao, “A Miniature Wideband Active Magnetic Probe Design with High Spatial Resolution and High Sensitivity for Near-field Measurement,” IEEE Microwave and Wireless Technology Letters, vol.33, no. 4, pp. 471-474, Apr. 2023. 
  4. Ze-Ming Wu, Lei Ji, Xiao-Chun Li*, Hong-Bin Zhu, Jun-fa Mao, “A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 5, pp. 594-603, May 2023. 
  5. Yu Zhu, Xiao-Chun Li* , Jun-Fa Mao,“Mode Composite Substrate Integrated Coaxial Line based on Substrate Integrated Coaxial Line and Periodic L-shaped SSPP Structure,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 4, pp. 528-536, Apr. 2023. 
  6. Ken Ning, Xiao-Chun Li*, yan shao*, Junfa Mao,“Low-Loss Wide-Bandwidth Planar Transmission Line with a Laminated Conductor,” SCIENCE CHINA Information Sciences，vol. 66, pp. 152304 :1-9, May 2023. 
  7. Zheng Li, Xiao-Chun Li*, Yu Zhu, Jun-Fa Mao, “Surrogate Modeling of High-Speed Links Based on GNN and RNN for Signal Integrity Applications,” IEEE Transactions on Microwave Theory and Techniques, vol. 71, no. 9, pp.3784-3796, Sept. 2023.
  8. X. Zhang, S. M. Liu, R. Zhao, X. C. Li, J. F. Mao, L. J. Jiang and P. Li, “A Wave Equation-Based Hybridizable Discontinuous Galerkin-Robin Transmission Condition Algorithm for Electromagnetic Problems Analyzing,”IEEE Transactions on Microwave Theory and Techniques, vol.71, no.4, pp. 1490-1500, April 2023. 
  9. 朱宏彬, 纪磊, 李晓春*, 毛军发. 基于慢波半模基片集成波导的紧凑型平衡滤波器设计[J]. 《电子学报》 |2023年第10期|2739-2746, 

2022年

  1. K. Ning, Xiao-Chun Li*, Y. Liu and J. Mao, "Two-Material Ridged Substrate Integrated Coaxial Line for Monomode Bandwidth Improvement," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 8, pp. 1358-1367, Aug. 2022. 
  2. Ken Ning, Xiao-Chun Li*, Gaobiao Xiao, Zong-Rui Xu, Junfa Mao, “Skew-Symmetric Slotted Waveguide with Mode Select Effect,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no.7, pp. 1150-1159, July 2022.
  3. Lei Ji, Hong-Bin Zhu, Xiao-Chun Li*, Jun-Fa Mao, “Two-Material-Filled Ridge Half-Mode Substrate Integrated Waveguide for Monomode Bandwidth Enhancement,” IEEE Microwave and Wireless Components Letters, vol.32, no.9, pp.1035-1038, April 2022.
  4. Yan Li, Xiao-Chun Li*, Yifan Yang, and Jun-Fa Mao, “An Unconditionally Stable 2-D Stochastic WLP-FDTD Method for Geometric Uncertainty in Superconducting Transmission Lines，” IEEE Transactions on Applied Superconductivity, vol. 32, no. 2, pp.1-9, Mar. 2022. 
  5. Yan Li, Xiao-Chun Li*, Junfa Mao, “Extended FDTD Method for Co-analysis of Superconducting Passive Transmission Lines and Josephson Junction Drivers and Receivers,” IEEE Transactions on Applied Superconductivity, vol.32, no.7, pp.1-8, Oct. 2022.
  6. X. Zhang, P. Li, X. C. Li*, L. J. Jiang and J. F. Mao, “A Hybridizable Discontinuous Galerkin Time-Domain Methodwith Robin Transmission Condition for Transient Thermal Analysis of 3-D Integrated Circuits,” IEEE Trans. Compon., Packag., Manuf. Technol., vol. 12, no. 9, pp. 1474-1483, Sept. 2022. 
  7. Xiaohan Yin,Xinyu Liu,Bangxing Gu,Jingjing Zhang, Xiaochun Li, Guanxiang Du, “Quantum near field probe for integrated circuits electromagnetic interference at wafer level,” International Journal of RF and Microwave and Computer-Aided Engineering,  vol. 32, no.4, pp.1-7 , Apr. 2022.

2021年

  1. Ken Ning, Xiao-Chun Li*, Han Zhang and Jun-fa Mao, “Ridged Substrate Integrated Coaxial Line for Wideband Millimeter-Wave Transmission,” IEEE Transactions on Microwave Theory and Techniques, vol. 69, no. 6, pp. 2981-2988, June 2021. 
  2. Lei Ji, Xiao-Chun Li*, Xin He and Jun-fa Mao, “A Slow Wave Ridged Half-Mode Substrate Integrated Waveguide with Spoof Surface Plasmon Polaritons,” IEEE Transactions on Plasma Science, vol. 49, no. 6, pp. 1818-1825, June 2021. 
  3. Xin He, Xiao-Chun Li*, Zhi-He Peng, Yu-Xu Liu and Jun-Fa Mao, “An Ultrawideband Magnetic Probe with High Electric Field Suppression Ratio,” IEEE Transactions on Instrumentation and Measurement, vol.70, pp. 8005309:1-9, Oct 2021. 
  4. Yu-xu Liu, Xiao-Chun Li*, Zhi-He Peng, Xin He, and Jun-Fa Mao, “A pair of parallel differential magnetic-field probes with high measurement accuracy and high electric-field suppression ratio,” International Journal of RF and Microwave and Computer-Aided Engineering, vol. 32, no.4, pp.1-7, Nov. 2020.

2020年

  1. Lei Ji, Xiao-Chun Li* , and Jun-Fa Mao，“Half-Mode Substrate Integrated Waveguide Dispersion Tailoring Using 2.5-D Spoof Surface Plasmon Polaritons Structure,”IEEE Transactions on Microwave Theory and Techniques, Vol. 68, No. 7, pp.2539-2550, July 2020. 
  2. Yifan Yang, Xiao-Chun Li*, Yan Li, IEEE, and Junfa Mao, “A Compact 2-D Stochastic FDTD Method for Uncertainty Analysis in Superconducting Transmission Lines,” IEEE Transactions on Applied Superconductivity, vol.30, no.8, Art no. 1500607-1:7, Dec. 2020.
  3. Zi-Wei Pei, Xiao-Chun Li*, Yan Li, and Jun-Fa Mao, "Transient Coanalysis of Multicoupled Passive Transmission Lines and Josephson Junctions Based on FDTD," IEEE Transactions on Applied Superconductivity, vol. 30, no. 1, pp.1-7, Jan. 2020. =

2019年

  1. 裴子溦，李晓春*，毛军发，“基于FDTD的约瑟夫森结与超导传输线协同分析方法，”电子学报，2019年, 第47卷，第10期，页码：2187-2191.
  2. 孙伟，李晓春*，毛军发, “基于WLP-FDTD 的带隙电源地平面噪声时域分析”, 上海交通大学学报，2019.5，第53卷，第5期，页码：569-574.
  3. 王香婷，李晓春*，毛军发，一种抑制同步开关噪声的EBG微带线互连，上海交通大学学报，2019.5，第53卷，第5期，页码：563-568.

2018年

  1. Yan Shao, Xiao-Chun Li*, Ning Wang, Lin-Sheng Wu, Min Tang and Jun-Fa Mao, “Theoretical and Experimental Investigation of HMSIW-Based High-Speed Data Transmission System Using QPSK Scheme,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, issue. 11, pp.1938-1947, Nov. 2018.
  2. Wang N., Li X. C., Mao J. F.，“High-Speed Interconnect System Using QPSK Scheme Based on Substrate Integrated Waveguide，”Journal of Circuits Systems and Computers, vol. 27, issue 1, pp.1- 19, 2018.
  3. 李晓春 ; 毛军发 , 基于基片集成波导的高速电子系统互连技术, 中国科学：信息科学, 2018.9, 页码：1165-1182.
  4. 唐旻，吴林晟，李晓春*，毛军发，集成电路碳纳米管互连建模与特性研究，上海交通大学学报，第52卷，第10期，页码：1135~1141, 2018年10月.

2017年

  1. Yan Shao, Xiao-Chun Li, Lin-Sheng Wu, Jun-Fa Mao, “A Wideband Millimeter-Wave Substrate Integrated Coaxial Line (SICL) Array for High-Speed Data Transmission,” IEEE Transactions on Microwave Theory and Techniques, vol. 65, No.8, pp.2789-2800, Aug. 2017.
  2. Xin Tan, Xiao-Chun Li, Junfa Mao, “Time-Domain Analysis of Noise Coupling Between Package and PCB Power/Ground Planes Based on WLP-FDTD,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, No.2, pp.269 - 275, Feb. 2017.

2015年

  1. Ning Wang, Xiao-Chun Li, Jun-fa Mao, “Improvement of Thermal Environment by Thermoelectric Coolers and Numerical Optimization of Thermal Performance,” IEEE Transactions on Electron Devices, vol. 62, no.8, pp.2579-2586, Aug. 2015.

2014年

  1. Zhen Wei, Xiao-Chun Li*, and Junfa Mao, “An accurate RLGC circuit model for dual tapered TSV structure, Journal of Semiconductors, vol.35, no.9, pp. 136-142, Sep. 2014.
  2. 沈利梅，李晓春*，毛军发，基于基片集成波导互连的16进制正交振幅调制高速传输系统，上海交通大学学报，2014，48（10），页码：1368-1371.

2011年

  1. Xiao-chun Li, Jun-fa Mao, and Swaminathan Madhavan, “Transient Analysis of CMOS-Gate-Driven RLGC Interconnects Based on FDTD,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 30, no. 4, pp. 574 – 583, Apr. 2011.

2009年

  1. Xiao-chun Li, Jun-Fa Mao, “An area-efficient very large scale integration architecture for modified Euclidean algorithm with dynamic storage technique,” International Journal of Electronics, 96(8), pp 837-842, Jun. 2009.

  2. 2008年论文

  3. Xiao-chun Li, Jun-fa Mao, Wen-yan Yin, “Dynamic Power Model of CMOS Gates Driving Transmission Lines Based on Fourier Analysis,” IEEE Transactions on Electron Devices, vol. 55, no. 2, pp.594-560, Feb. 2008.

  4. 2006年论文

  5. Xiao-chun Li and Junfa Mao, “A New Delay Model for Distributed RLC Trees,” Journal of Active and Passive Electronic Devices, vol. 1 pp. 259–271, Jan. 2006.
  6. Xiao-chun Li and Junfa Mao, “An Area-Efficient Euclid Architecture with Low Latency,” Journal of Active and Passive Electronic Devices, vol. 1 pp. 221–227, Jan. 2006.

2005年

  1. Xiao-chun Li, Jun-fa Mao, Huang Hui-fen and Liu Ye, “Global Interconnect Width and Spacing Optimization for Latency, Bandwidth and Power Dissipation,” IEEE Transactions on Electron Devices, 2005, vol. 52, no. 10, pp. 2272–2279, Oct. 2005.
  2. Min Tang, Jun-Fa Mao and Xiao-chun Li, “Analysis of Interconnects with Frequency-Dependent Parameters by Differential Quadrature Method,” IEEE Microwave and Wireless Components Letters, vol.15, no.12, pp. 877-879, Dec. 2005.
  3. Hui-Fen Huang, Jun-Fa Mao, Xiao-chun Li, and Zhengfan Li, “A photonic bandgap microstrip filter based on YBCO superconducting film,” IEEE Transactions on Applied Superconductivity, vol.15, no.3, pp. 3827–3830, Mar. 2005.
  4. Feng Cheng, Junfa Mao, and Xiao-chun Li, “Timing-driven placement based on path topology analysis,” IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, vol. E88, no. 8, pp. 2227–2230, Aug. 2005.

2004年

  1. Xiao-chun Li and Jun-fa Mao, “Accurate Analysis of Interconnect Trees with Distributed RLC Model and Moment Matching”, IEEE Transactions on Microwave Theory and Techniques, vol. 52, no.9, pp. 2199 – 2206, Sept. 2004.

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