Xiao-Chun. Li, Professor 

        Professor of Department of Electronic Engineering, Shanghai Jiao Tong University and Ministry of Education Key Laboratory of High-Speed Electronic System Design and Electromagnetic Compatibility. She is a project leader of the National Science Fund for Excellent Young Scholars and winner of Morning Star Scholar, Shanghai Jiaotong University.
Her research interests include high-speed and microwave circuits, interconnection technology, electromagnetic compatibility and other research work. She has published more than 60 papers, including 12 SCI papers and 42 EI papers. She hosted or participated in the National Natural Science Foundation for Excellent Young Scientists, the National Natural Science Foundation for Youth Science, the National Natural Science Foundation for Innovation Research, the Science Foundation, the 973 Project, the 863 Project, the Samsung Project, and the Huawei Project. She was awarded the second prize of National Technology Invention, the first prize of Shanghai Science and Technology Progress Award, the nomination of national outstanding doctoral thesis, the outstanding achievements of Shanghai graduate students (dissertation), the international Dachuan Intelligence and Communication Fund Research Award, and the Candlelight Award of Shanghai Jiaotong University. She is a member of the Youth Science Club of the China Electronics Association, a senior member of the Chinese Institute of Electronics, and a guest editor of the English edition of the Journal of Shanghai Jiaotong University.

Education                                                
Mar.2003～Sept.2007  Ph.D., Department of Electronic Engineering, Shanghai Jiao Tong University，China   
Sept.1999～Mar.2002  M.S., Department of Electronic Engineering, Tianjin University, China.
Sept.1995～Jun.1999  B.S., Department of Electronic Engineering, Tianjin University, China. 
Work Experience                                        
Apr. 2008~Apr. 2009   Visiting scholar, School of Electrical and Computer Engineering, Georgia Institute of Technology.
Mar. 2002～Present    Faculty and Associate Professor from 2009, Department of Electronic Engineering, Shanghai Jiao Tong University
Academic Honors and Awards                               

• First-class Science and Technology Research Award, by Shanghai municipal government, 2005. (Award number: 2005010003-1-05)
• Second–class National Technology Invention Award, by the State Council of China, 2008. 
• (Award number: 2008-F-236-2-03-R05)
• Excellent Ph.D Dissertation Award, by the Education Committee of Shanghai, 2011.
• Excellent Ph. D Dissertation nomination award, by the Education Committee of China, 2011.
• Okawa foundation research grant, by Okawa Research Foundation, 2014.
• Outstanding Youth Foundation, by National Natural Science Foundation of China, 2016.

Research Projects                                        

• 2016.01-2018.12   High-speed electrical interconnects, supported by National Natural Science Foundation of China excellent youth fund. 
• 2015.01-2015.12   Analysis of WiFi desensing through the EMI modeling of a PCB module with multiple IC/PKG's ,supported by Samsung Electronics Co., Ltd.,
• 2015.01-2015.12   Research on high-speed interconnection method on boards, supported by Samsung Electronics Co., Ltd.
• 2014.01-2014.12   Research on modeling and design of Power distribution network (PDN), supported by Okawa Foundation Research Grant Program.
• 2013.3-2014.3     Research on Signal and Power Integrity Co-analysis and Design in Multilayer Packages, supported by Samsung Electronics Co., Ltd.
• 2014.07-2015.01   Amplification technique of pulse generation, Shanghai Zizhun Institute.
• 2014.07-2015.01   Signal shaping technique of pulse generation, Shanghai Zizhun Institute.
• 2014.03-2015.03   Samsung Electronics Co., Ltd., Research on Signal and Power Integrity Co-analysis and Design in Multilayer Packages.
• 2013.04-2014.03  Samsung Electronics Co., Ltd., Research on power integrity (PI) characteristic in the multi layer PCB that tests low power & high speed device and its solutions.
• 2013.01-2013.12  Research on substrate integrated waveguide, supported by Shanghai Jiao Tong University.
• 2012.02-2014.02  3D thermal analysis of sytem on package based on electrothermal coupling , supported by Key Laboratory of Ministry of Education of China.
• 2011.01~2011.12   Eletrothermal Problem of Interconnects in High-speed Circuits , supported by ministry of education of China.
• 2011.01~2011.12  Electrothermal analysis of System on Package, supported by Shanghai Jiao Tong University.
• 2009.01~2011.12   Electrothermal Analysis of Interconnects in SOC, supported by National Natural Science Foundation of China under Grant 60806012.
• 2009.01~2013.08  Fundamental Research on Sytem on Package, National Basic Research Program of China under Grant 2009CB320200.
• 2006.01～2011.12  Interconnect Research and IP core design in SOC, supported by National Science Foundation for Creative Research Groups of China.
• 2006.01～2007.01 Interconnect simulation and design in Deep Submicron Technologies, supported by Shanghai Jiao Tong University.
• 2004.05～2005.09  High-speed interconnect simulation and test technique in DSM technologies, supported by Huawei Corporation.
• 2003.01～2005.12  Interconnect model, simualtion and synthesis in SOC, supported by National Science Foundation.
• 2002.09～2003.12  EDA techniques in DSM technologies, supported by National high-research Foundation.
• 2002.01～2003.12  Placement and routing considering interconnect effects in VLSI, supported by AM Corporation.

Published Articles （Ｐａｒｔｓ）                                               

1. Wang N., Li X. C., Mao J. F., “High-Speed Interconnect System Using QPSK Scheme Based on Substrate Integrated Waveguide，”Journal of Circuits Systems and Computers, vol. 27, issue 1, pp: 19, 2018.
2. Yan Shao, Xiao-Chun Li, Lin-Sheng Wu, Jun-Fa Mao, “A Wideband Millimeter-Wave Substrate Integrated Coaxial Line (SICL) Array for High-Speed Data Transmission,” IEEE Transactions on Microwave Theory and Techniques, vol. 65, No.8, pp.2789-2800, Aug. 2017.
3. Xin Tan, Xiao-Chun Li, Junfa Mao, “Time-Domain Analysis of Noise Coupling Between Package and PCB Power/Ground Planes Based on WLP-FDTD,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, No.2, pp.269 - 275, Feb. 2017.
4. Ning Wang, Xiao-Chun Li, Jun-fa Mao, “Improvement of Thermal Environment by Thermoelectric Coolers and Numerical Optimization of Thermal Performance,” IEEE Transactions on Electron Devices，vol. 62, no.8, pp.2579-2586, Aug. 2015.
5. Xiao-chun Li, Jun-fa Mao, and Swaminathan Madhavan, “Transient Analysis of CMOS-Gate-Driven RLGC Interconnects Based on FDTD,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 30, no. 4, pp. 574 – 583, Apr. 2011.
6. Xiao-chun Li, Mao, Jun-Fa, “An area-efficient very large scale integration architecture for modified Euclidean algorithm with dynamic storage technique,” International Journal of Electronics, 96(8), pp 837-842, Jun. 2009.
7. Xiao-chun Li, Jun-fa Mao, Wen-yan Yin, “Dynamic Power Model of CMOS Gates Driving Transmission Lines Based on Fourier Analysis,” IEEE Transactions on Electron Devices, vol. 55, no. 2, pp.594-560, Feb. 2008. 
8. Xiao-chun Li, Mao Jun-fa, Huang Hui-fen and Liu Ye, “Global Interconnect Width and Spacing Optimization for Latency, Bandwidth and Power Dissipation,” IEEE Transactions on Electron Devices, 2005, vol. 52, no. 10, pp. 2272–2279, Oct. 2005.
9. Xiao-chun Li and Jun-fa Mao, “Accurate Analysis of Interconnect Trees with Distributed RLC Model and Moment Matching”, IEEE Transactions on Microwave Theory and Techniques, vol. 52, no.9, pp. 2199 – 2206, Sept. 2004.
10. Min Tang, Jun-Fa Mao and Xiao-chun Li, “Analysis of Interconnects with Frequency-Dependent Parameters by Differential Quadrature Method,” IEEE Microwave and Wireless Components Letters, vol.15, no.12, pp. 877-879, Dec. 2005. 
11. Hui-Fen Huang, Jun-Fa Mao, Xiao-chun Li, andZhengfan Li, “A photonic bandgap microstrip filter based on YBCO superconducting film,” IEEE Transactions on Applied Superconductivity, vol.15, no.3, pp. 3827–3830, Mar. 2005.
12. Feng Cheng, Junfa Mao, and Xiao-chun Li, “Timing-driven placement based on path topology analysis,” IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, vol. E88, no. 8, pp. 2227–2230, Aug. 2005.