High-speed interconnect technology - the key technology for high-speed data transmission

• Put forward a terabit millimeter wave interconnection technology

Difficulty:

The narrow bandwidth, high loss, and severe crosstalk of conventional interconnect technology make it hard to meet the requirement of high bit-rate data transmission.

Innovation:

1. An on-chip interconnect design method based on multi-objective optimization was proposed. A new type of millimeter wave interconnect technology was proposed to implement terabit data transmission.
2. Corresponding papers were published in the microwave industry's top international publications IEEE Trans. MTT 2017, and in the world's top electronic publications in the field of electronic devices IEEE Trans. ED 2015. The proposed technologies were applied in Huawei's high-speed data transmission link.

• Multi-objective optimization technology for on-chip nano interconnects

Technical requirements: Multi-performance goal optimization  improves interconnect signal integrity

Goals:

1. Delay  
2. Bandwidth  
3. Power consumption
4. Area

Solution:

1. Interconnect structure optimization
2. Interconnect line size optimization
3. Buffer Inserttion optimization

Achievements:

1. Multi-performance objective function 
2. The optimal interconnect size
3. Buffer design method

Innovation：
A comprehensive optimization design principle and a method for time delay, power consumption, and bandwidth were proposed. The optimal design parameters for the global interconnects of the 45-130 nm process were obtained, which can improve the overall interconnect performance over 30% without increasing costs.

Application:
Mentor Graphics uses this technology to design and implement a variety of on-chip network chips: butterfly interconnects and heterogeneous unit communication interconnects.

• Large-scale integrated circuit EDA technology

Innovation:

1. Precise time delay and power consumption model for nano interconnects
2. Self-developed layout, routing and simulation software for large-scale integrated circuits
3. Application in CADENCE (the world's largest EDA software company)

• Electromagnetic Compatibility Technology - Key Technologies of High Speed Electronic Systems

Innovation:

1. A signal response analysis method based on accurate transmission line model 
2. A multi-scale power integrity analysis method 
3. An electromagnetic compatibility measurement and diagnosis of integrated systems