Electromagnetic Compatibility Technology - Key Technologies for High-Speed Electronic Systems

Background:
High-density integrated components, such as multi-chip modules (MCM), system-in-package (SIP), use high-density integration technology to integrate digital integrated circuits, analog integrated circuits, RF microwave circuits, antennas, and even optical devices. High-density integrated technology makes the functions and performance of electronic systems continuously improve. At the same time, electromagnetic compatibility problems such as electromagnetic interference, signal integrity, and power integrity of the system are becoming increasingly prominent. The greater the density of components and the higher the operating speed, the more serious the problem of electromagnetic compatibility is.
Key research:

• Electromagnetic near-field signal detection technology
• Electromagnetic field reconstruction and imaging technology
• Electromagnetic interference diagnosis and suppression technology