Research
- 2016.01-2018.12 High-speed electrical interconnects, supported by National Natural Science Foundation of China excellent youth fund.
- 2015.01-2015.12 Analysis of WiFi desensing through the EMI modeling of a PCB module with multiple IC/PKG's ,supported by Samsung Electronics Co., Ltd.,
- 2015.01-2015.12 Research on high-speed interconnection method on boards, supported by Samsung Electronics Co., Ltd.
- 2014.01-2014.12 Research on modeling and design of Power distribution network (PDN), supported by Okawa Foundation Research Grant Program.
- 2013.3-2014.3 Research on Signal and Power Integrity Co-analysis and Design in Multilayer Packages, supported by Samsung Electronics Co., Ltd.
- 2014.07-2015.01 Amplification technique of pulse generation, Shanghai Zizhun Institute.
- 2014.07-2015.01 Signal shaping technique of pulse generation, Shanghai Zizhun Institute.
- 2014.03-2015.03 Samsung Electronics Co., Ltd., Research on Signal and Power Integrity Co-analysis and Design in Multilayer Packages.
- 2013.04-2014.03 Samsung Electronics Co., Ltd., Research on power integrity (PI) characteristic in the multi layer PCB that tests low power & high speed device and its solutions.
- 2013.01-2013.12 Research on substrate integrated waveguide, supported by Shanghai Jiao Tong University.
- 2012.02-2014.02 3D thermal analysis of sytem on package based on electrothermal coupling , supported by Key Laboratory of Ministry of Education of China.
- 2011.01~2011.12 Eletrothermal Problem of Interconnects in High-speed Circuits , supported by ministry of education of China.
- 2011.01~2011.12 Electrothermal analysis of System on Package, supported by Shanghai Jiao Tong University.
- 2009.01~2011.12 Electrothermal Analysis of Interconnects in SOC, supported by National Natural Science Foundation of China under Grant 60806012.
- 2009.01~2013.08 Fundamental Research on Sytem on Package, National Basic Research Program of China under Grant 2009CB320200.
- 2006.01～2011.12 Interconnect Research and IP core design in SOC, supported by National Science Foundation for Creative Research Groups of China.
- 2006.01～2007.01 Interconnect simulation and design in Deep Submicron Technologies, supported by Shanghai Jiao Tong University.
- 2004.05～2005.09 High-speed interconnect simulation and test technique in DSM technologies, supported by Huawei Corporation.
- 2003.01～2005.12 Interconnect model, simualtion and synthesis in SOC, supported by National Science Foundation.
- 2002.09～2003.12 EDA techniques in DSM technologies, supported by National high-research Foundation.
- 2002.01～2003.12 Placement and routing considering interconnect effects in VLSI, supported by AM Corporation.
Copyright© 高速互连与电磁兼容技术
技术支持: 维程互联