X. He, Y. -X. Liu and X. -C. Li, "A Wideband Dual-Component Electric Probe for Near-Field Measurement," in IEEE Sensors Journal, doi: 10.1109/JSEN.2024.3406637.
C. -S. Sun, X. -C. Li, H. -B. Zhan and K. Ning, "A Low-Loss and High-Bandwidth Hollow Rectangular Dielectric Waveguide for Sub-THz Applications," in IEEE Transactions on Microwave Theory and Techniques, doi: 10.1109/TMTT.2024.3382399.
H. -B. Zhan, X. -C. Li and C. -S. Sun, "Low-Loss Horizontal Transition Between Rectangular Dielectric Waveguide and Microstrip Line at W-Band," in IEEE Microwave and Wireless Technology Letters, vol. 34, no. 4, pp. 371-374, April 2024, doi: 10.1109/LMWT.2024.3368444.
Z. Gao, Y. -X. Liu, X. -C. Li, Z. -M. Wu, Z. Li and T. Tan, "An Equivalent Radiation Source Reconstruction Method Based on Enhanced Artificial Neural Network," in IEEE Transactions on Electromagnetic Compatibility, doi: 10.1109/TEMC.2024.3390233
Zhang R, Li X C, Liu Q H. "Switchable and multifunctional terahertz photonic devices based on VO2-assisted phase encoded metasurfaces"[J]. Optics & Laser Technology, 2024, 174: 110568.
Y. -X. Liu, X. -C. Li, X. He, Z. -H. Peng and J. -F. Mao, "An Ultra-Wideband Electric Field Probe With High Sensitivity for Near-Field Measurement," in IEEE Transactions on Instrumentation and Measurement, vol. 72, pp. 1-10, 2023, Art no. 8001910, doi: 10.1109/TIM.2023.3261946.
X. He, X. Li, Y. Liu and J. Mao, "A High-Performance Miniaturized Wideband Active Electric Probe Design," in IEEE Antennas and Wireless Propagation Letters, vol. 22, no. 12, pp. 2866-2870, Dec. 2023, doi: 10.1109/LAWP.2023.3302912.
Y. Zhu, X. -C. Li and J. -F. Mao, "Mode Composite Substrate Integrated Coaxial Line based on Substrate Integrated Coaxial Line and Periodic L-shaped SSPP Structure," IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2023.3267839.
Z. -M. Wu, L. Ji, X. -C. Li, H. -B. Zhu and J. -F. Mao, "A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design," IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2023.3278736.
Z. Li, X. -C. Li, Z. -M. Wu, Y. Zhu and J. -F. Mao, "Surrogate Modeling of High-Speed Links Based on GNN and RNN for Signal Integrity Applications," IEEE Transactions on Microwave Theory and Techniques, doi: 10.1109/TMTT.2023.3251658.
X. He, X. -C. Li*, Y. -X. Liu and J. -F. Mao, "A Miniature Wideband Active Magnetic Probe Design With High Spatial Resolution and High Sensitivity for Near-Field Measurement," IEEE Microwave and Wireless Technology Letters, doi: 10.1109/LMWT.2022.3229498.
X. Zhang, S. M. Liu, R. Zhao, X. C. Li*, J. F. Mao, L. J. Jiang and P. Li, “A Wave Equation-Based Hybridizable Discontinuous Galerkin-Robin Transmission Condition Algorithm for Electromagnetic Problems Analyzing,” IEEE Transactions on Microwave Theory and Techniques, 2022.
X. Zhang, P. Li, X. C. Li*, L. J. Jiang and J. F. Mao, “A Hybridizable Discontinuous Galerkin Time-Domain Method with Robin Transmission Condition for Transient Thermal Analysis of Three-Dimensional Integrated Circuits,” IEEE Trans. Compon., Packag., Manuf. Technol., vol. 12, no. 9, pp. 1474-1483, Sept. 2022.
K. Ning, X. -C. Li, Y. Liu and J. Mao, "Two-Material Ridged Substrate Integrated Coaxial Line for Monomode Bandwidth Improvement," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 8, pp. 1358-1367, Aug. 2022.
K. Ning, X. -C. Li, G. Xiao, Z. -R. Xu and J. Mao, "Skew-Symmetric Slotted Waveguide With Mode Select Effect," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 7, pp. 1150-1159, July 2022.
L. Ji, H. -B. Zhu, X. -C. Li and J. -F. Mao, "Two-Material-Filled Ridge Half-Mode Substrate Integrated Waveguide for Monomode Bandwidth Enhancement," IEEE Microwave and Wireless Components Letters, vol. 32, no. 9, pp. 1035-1038, Sept. 2022.
Yan Li, Xiao-Chun Li*, Yifan Yang, and Jun-Fa Mao, “An Unconditionally Stable 2-D Stochastic WLP-FDTD Method for Geometric Uncertainty in Superconducting Transmission Lines” IEEE Transactions on Applied Superconductivity, vol. 32, no. 2, pp.1-9, Mar. 2022.
X. He, X. -C. Li*, Z. -H. Peng, Y. -X. Liu and J. -F. Mao, "An Ultrawideband Magnetic Probe With High Electric Field Suppression Ratio," IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 1-9, 2021
Lei Ji, Xiao-Chun Li*, Xin He and Jun-fa Mao, “A Slow Wave Ridged Half-Mode Substrate Integrated Waveguide With Spoof Surface Plasmon Polaritons,” IEEE Transactions on Plasma Science, vol. 49, no. 6, pp. 1818-1825, June 2021.
Ken Ning, Xiao-Chun Li*, Han Zhang and Jun-fa Mao, “Ridged Substrate Integrated Coaxial Line for Wideband Millimeter-Wave Transmission,” IEEE Transactions on Microwave Theory and Techniques, vol. 69, no. 6, pp. 2981-2988, June 2021.
Yu-Xu Liu, Xiao-Chun Li*, Zhi-He Peng, Xin He, and Jun-Fa Mao, “A pair of parallel differential magnetic‐field probes with high measurement accuracy and high electric‐field suppression ratio,” International Journal of RF and Microwave Computer‐Aided Engineering, 31:e22478, 2021.
Yi-fan Yang, Xiao-Chun Li*, Yan Li and Jun-fa Mao, "A Compact 2-D Stochastic FDTD Method for Uncertainty Analysis in Superconducting Transmission Lines," IEEE Transactions on Applied Superconductivity, vol. 30, no. 8, pp.1-7, Dec. 2020.
Lei Ji, Xiao-Chun Li*, Jun-Fa Mao, “Half-Mode Substrate Integrated Waveguide Dispersion Tailoring Using 2.5-D Spoof Surface Plasmon Polaritons Structure,” IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 7, pp.2539-2550, May. 2020.
Zi-Wei Pei, Xiao-Chun Li*, Yan Li, and Jun-Fa Mao, "Transient Coanalysis of Multicoupled Passive Transmission Lines and Josephson Junctions Based on FDTD," IEEE Transactions on Applied Superconductivity, vol. 30, no. 1, pp.1-7, Jan. 2020.
Yan Shao, Xiao-Chun Li*, Ning Wang, Lin-Sheng Wu, Min Tang and Jun-Fa Mao, “Theoretical and Experimental Investigation of HMSIW-Based High-Speed Data Transmission System Using QPSK Scheme,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, issue. 11, pp.1938-1947, Nov. 2018.
Wang N., Li X. C*., Mao J. F., “High-Speed Interconnect System Using QPSK Scheme Based on Substrate Integrated Waveguide,”Journal of Circuits Systems and Computers, vol. 27, issue 1, pp:1-19, 2018.
Yan Shao, Xiao-Chun Li, Lin-Sheng Wu, Jun-Fa Mao*, “A Wideband Millimeter-Wave Substrate Integrated Coaxial Line (SICL) Array for High-Speed Data Transmission,” IEEE Transactions on Microwave Theory and Techniques, vol. 65, No.8, pp.2789-2800, Aug. 2017.
Xin Tan, Xiao-Chun Li, Jun-Fa Mao, “Time-Domain Analysis of Noise Coupling Between Package and PCB Power/Ground Planes Based on WLP-FDTD,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, No.2, pp.269 - 275, Feb. 2017.
Ning Wang, Xiao-Chun Li, Jun-fa Mao, “Improvement of Thermal Environment by Thermoelectric Coolers and Numerical Optimization of Thermal Performance,” IEEE Transactions on Electron Devices, vol. 62, no.8, pp.2579-2586, Aug. 2015.
Xiao-chun Li, Jun-fa Mao, and Swaminathan Madhavan, “Transient Analysis of CMOS-Gate-Driven RLGC Interconnects Based on FDTD,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 30, no. 4, pp. 574 – 583, Apr. 2011.
Xiao-chun Li*, Mao, Jun-Fa, “An area-efficient very large scale integration architecture for modified Euclidean algorithm with dynamic storage technique,” International Journal of Electronics, 96(8), pp 837-842, Jun. 2009.
Xiao-chun Li, Jun-fa Mao, Wen-yan Yin, “Dynamic Power Model of CMOS Gates Driving Transmission Lines Based on Fourier Analysis,” IEEE Transactions on Electron Devices, vol. 55, no. 2, pp.594-560, Feb. 2008.
Xiao-chun Li, Mao Jun-fa, Huang Hui-fen and Liu Ye, “Global Interconnect Width and Spacing Optimization for Latency, Bandwidth and Power Dissipation,” IEEE Transactions on Electron Devices, 2005, vol. 52, no. 10, pp. 2272–2279, Oct. 2005.
Xiao-chun Li and Jun-fa Mao, “Accurate Analysis of Interconnect Trees with Distributed RLC Model and Moment Matching”, IEEE Transactions on Microwave Theory and Techniques, vol. 52, no.9, pp. 2199 – 2206, Sept. 2004.
Min Tang, Jun-Fa Mao and Xiao-chun Li, “Analysis of Interconnects with Frequency-Dependent Parameters by Differential Quadrature Method,” IEEE Microwave and Wireless Components Letters, vol.15, no.12, pp. 877-879, Dec. 2005.
Hui-Fen Huang, Jun-Fa Mao, Xiao-chun Li, andZhengfan Li, “A photonic bandgap microstrip filter based on YBCO superconducting film,” IEEE Transactions on Applied Superconductivity, vol.15, no.3, pp. 3827–3830, Mar. 2005.
Feng Cheng, Junfa Mao, and Xiao-chun Li, “Timing-driven placement based on path topology analysis,” IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, vol. E88, no. 8, pp. 2227–2230, Aug. 2005.
Xiao-chun Li* and Junfa Mao, “A New Delay Model for Distributed RLC Trees,” Journal of Active and Passive Electronic Devices, vol. 1 pp. 259–271, Jan. 2006.
Xiao-chun Li* and Junfa Mao, “An Area-Efficient Euclid Architecture with Low Latency,” Journal of Active and Passive Electronic Devices, vol. 1 pp. 221–227, Jan. 2006.
Wei sun, Xiao-Chun Li*, Jun-Fa Mao,“Time-Domain Analysis of Noise in Power/Ground Planes with Narrow Slots Based on WLP-FDTD,”Journal of Shanghai Jiaotong University, vol. 53, no. 5, pp. 569-574, May 2019.
Zhen Wei, Xiaochun Li, and Junfa Mao, “An accurate RLGC circuit model for dual tapered TSV structure,” Journal of Semiconductors, vol.35, no.9, pp. 136-142,Sept. 2014.
Li-Mei Shen, Xiao-Chun Li*, Jun-Fa Mao , “16QAM high-speed transmission system using substrate integrated waveguide-type interconnect,” Journal of Shanghai Jiaotong University, vol.48, issue.10, pp. 1368-1371, Oct. 2014.